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| BGCF CHIP BEAD |
Introduction
Multi-layer Chip Bead can restrain and absorb availably EMI/ RFI from electronic equipment. There are better terminal strength、resistance to bending strength、heat-resistance and solderability, ideal for re-flow or wave soldering required for automatic mounting applications.
BGCF high current bead is available for surface mounting of electronic equipment. The bead has high impedance and remarkable EMI Suppression over a wide frequency range.
The impedance of Surge Chip Bead raises acutely at a certain frequency range, So Surge Chip Bead can get high attenuation effect and has no influence to the semaphore.
Features
| 1) |
There is higher impedance than inserted chip bead at the same dimensions |
| 2) |
Figuration and dimensions according with EIA standard, no lead suitable for SMT |
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Dimensions
| Type |
Dimensions[mm(inches)] |
L |
W |
T |
a |
1608 |
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0. 8± 0.15
[0.031± 0.006] |
0.3±0.2
[0.012±0.008] |
2012 |
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1. 25± 0.2
[0.049± 0.008] |
0.85±0.2
[0.033±0.008]
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0.5±0.3
[0.02±0.012] |
1.25±0.2
[0.049±0.008] |
3216 |
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1. 6± 0.2
[0.063± 0.008] |
1.1±0.3
[0.043±0.012] |
0.5±0.3
[0.02±0.012] |
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Specifications
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Class |
Type |
Impedance
(Ω) |
Test frequency
(MHz) |
DC Resistance
(Ω) |
Rated current
(mA) |
General |
BGCF1608 |
5～2500 |
100 |
0.05～1.20 |
50～1000 |
BGCF2012 |
7～2200 |
100 |
0.05～1.00 |
100～1500 |
BGCF3216 |
19～3000 |
50,100 |
0.05～1.20 |
100～2000 |
High
Current
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BGCF1608C |
20～600 |
100 |
0.03～0.20 |
1000～3000 |
BGCF2012C |
7～1000 |
100 |
0.01～0.30 |
1000～6000 |
BGCF3216C |
19～1000 |
100 |
0.01～0.30 |
1000～6000 |
surge |
BGCF1608S |
5～1000 |
100 |
0.3～0.7 |
100～500 |
BGCF2012S |
5～2000 |
100 |
0.2～0.8 |
150～500 |
BGCF3216S |
19～2000 |
100 |
0.2～0.6 |
100～500 |
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